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   Device-Package Interaction and Gate Driver Layout Analysis in SiC MOSFET Power Modules for More Electric Aircraft Motor Drive Applications   [View] 
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 Author(s)   Shane O'DONNELL 
 Abstract   This paper presents measurements and comparison analysis of 1200 V SiC MOSFET gate drive signalsin two different integrated power solutions designed for More Electric Aircraft motor drive applications.The modules are designed to accommodate a 540 V high voltage DC bus and have a maximum outputphase current of 25 A peak. Both modules comprise of typical three-phase inverter bridgeconfigurations, with 40 mO MOSFETs and 20 A anti-parallel diodes. However, their gate drivers,printed circuit board layouts and substrate designs are different and the effect these elements have onthe performance is presented. The results illustrate that gate resistances, package interactions and PCBlayout can have a major effect on performance while variations in switching frequency, from 10 kHz to50 kHz, and a reduction in dead-time, from 500 ns to 375 ns, have negligible impacts. 
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Filename:0403-epe2018-full-18550239.pdf
Filesize:1.851 MB
 Type   Members Only 
 Date   Last modified 2019-05-05 by System