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THERMAL RESISTANCE ANALYSIS BY INDUCED TRANSIENT METHOD (TRAIT) APPLIED TO POWER ELECTRONIC DEVICE PACKAGING
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| Author(s) |
P. E. Bagnoli; C. Casarosa; E. Dallago; A. Maiema; G. Sassone |
| Abstract |
The TRAIT method consists of a new technique for characterising the equivalent thermal circuit of a .semiconductor power device and its packaging. It allows the experimental evaluation of the total thermal resistance as a sum of several contributions due to the various parts of the system. All the thermal capacitive component can be also evaluated. This method was applied to power integrated circuits mounted on assembling structures used for automotive electronics. Some purposely induced defects in the thermal properties of some parts of the structure was revealed and identified. |
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| Filename: | Unnamed file |
| Filesize: | 575 KB |
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| Type |
Members Only |
| Date |
Last modified 2018-05-18 by System |
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