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   Paralleling High Power Dual Modules: A Challenge for Application Engineers and Power Device Manufacturers   [View] 
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 Author(s)   Jan WEIGEL 
 Abstract   This paper discusses the challenges of paralleling dual modules with special focus on the currentlyintroduced dual modules like LinPak, nHPD2, XHP, LV/HV100, etc.. Compared with IHM/IHVmodules3 to 4 times as many modules have to be paralleled to achieve the same output power. Therefore theparallel connection will play a major role in designing high power converters, used e.g. in tractionapplications. This paper explains the reasons of current mismatch in parallel connection of IGBTmodules and gives suggestions how to minimize current imbalance. 
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Filename:0416-epe2017-full-16152109.pdf
Filesize:730.6 KB
 Type   Members Only 
 Date   Last modified 2018-04-17 by System