| Abstract |
With commercial operation of the first Chinese Maglev line, lifetime prediction of power devices inMaglev choppers becomes a crucial topic. This paper adopts a mission profile of one typical Maglevchopper for lifetime prediction. A test rig is built for the IGBT/Diode case temperature measurement.Using look-up tables of IGBT/Diode module losses, an accurate electro-thermal model can beestablished. The thermal impedance of the heatsink is extracted by using the simulated case temperaturecurve to fit the experiment curve. So the junction temperature for the given mission profile could beestimated according to the typical current mission profile. Different lifetime models including analyticand physical methods are used to evaluate the lifetime. It can be concluded that using redundant chips(higher current rating) could be very helpful to increase the lifetime of key components, i.e. IGBTs. |
