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Experimental and Simulative Investigations on Stray Capacitances and Stray Inductances of Power Modules
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| Author(s) |
Georges ENGELMANN |
| Abstract |
This paper presents different experimental methods for measuring parasitic capacitances and inductancesof direct copper bond (DBC) based power semiconductor modules. The found parasitics are comparedwith finite element simulations to evaluate their accuracy. A very good match of the simulated andmeasured stray capacitances is found.The parasitics, which are found via simulations and experiments, are integrated into a full equivalent circuitof the power module that can be used in SPICE simulations. The model is evaluated by a comparisonwith double pulse measurements for three examplary operating points. Satisfying simulation results ofthe developed model can be shown for the given operating points. |
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| Filename: | 0344-epe2017-full-21134144.pdf |
| Filesize: | 1.639 MB |
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| Type |
Members Only |
| Date |
Last modified 2018-04-17 by System |
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