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   Comparative analysis of GaN HEMT vs. Si CoolMOS for a High-Frequency MMC Topology   [View] 
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 Author(s)   ANDER AVILA 
 Abstract   The performance of a Modular Multilevel Converter (MMC) is presented in this paper, comparing Silicon(Si) and Gallium Nitride (GaN) semiconductors. Moreover, the benefits of high-frequency operation ina MMC topology are analysed along with a power loss distribution evaluation, highlighting the mainadvantages and drawbacks of different semiconductor technologies. 
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Filename:0600-epe2017-full-15530554.pdf
Filesize:2.711 MB
 Type   Members Only 
 Date   Last modified 2018-04-17 by System