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A Low-Cost and High-Performance Thermal Interface Assembly between Printed Circuit Board and Heat-sink
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| Author(s) |
Nicolas DEGRENNE |
| Abstract |
This paper presents a new and low-cost thermal interface assembly between a printed circuit board and a heat-sink that provides electric isolation on the whole surface, and thermal conduction where needed. The assembly relies on the association of an isolation and a spacer layer and a thermo-conductive gel. The bill of material is 8 times lower than a best in class thermal pad, and equivalent thermal resistance is 30\% lower. |
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| Filename: | 0117-epe2017-full-16442461.pdf |
| Filesize: | 485.9 KB |
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| Type |
Members Only |
| Date |
Last modified 2018-04-17 by System |
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