| Abstract |
Recently developed press-pack IGBT (PPI) modules, which feature higher voltage rating, larger thermal capacity, faster switching speed and easy utilization in series, have become a serious competitor with solder plastic IGBT modules in the field of voltage-source-converter based high-voltage-direct-current (VSC-HVDC) transmission systems. To give a comprehensive investigation of press-pack IGBT modules, a platform to test dynamic switching performance for press-pack IGBT modules is designed and implemented by employing the principle of double-pulse test in this paper. The effects of external parameters--DC-link voltage, load current and junction temperature on dynamic performance of press-pack IGBT modules are characterized in detail, and their relative variation mechanism for switching performance of press-pack IGBT is confirmed with experimental results and analyzed from the view of semiconductor physics. |
