| Abstract |
Many industrial applications require higher and higher power to volume ratio, so that manufacturers have achieved switch functions, composed of semiconductor chips associated in
parallel within power modules. Therefore, we have developed a 3D electrothermal simulation tool which solves heat conduction equation in stationnary condition, and the electrical linear system of the parallel association which takes into account the thermal behaviour of each chip. Thus, we are
able to study some electrical and thermal imbalances of the power multi-chips module, and to contribute to a safe and reliable conception. |
