| Abstract |
With standard high power IGBT modules, a new packaging technology, using internal soldered electrical contact instead of pressed contact, appears to design the traction converters. This paper presents accelerated tests of power thermal cycling on more than 30 IGBT modules from three manufacturers, to estimate the influent parameters on the life expectancy in traction working conditions. Also several test conditions are changed, as variation of the junction temperature, heating current, maximal junction temperature. To clarify the behaviour of this complex technology module, a qualitative analysis of the thermal stress is proposed. The conditions of tests, the criteria of failures and the methodology of measurement are discussed. The results are presented with signiticative types of failures and some analysis of the INRETS tests. Failures on direct wire bond with high current density are discussed. |
