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Temperature estimation for wire bondings in power semiconductor devices
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| Author(s) |
Bernhard ULLRICH |
| Abstract |
The detection of the junction temperature of power electronic devices during operation plays a central role in reliability and thermal management strategies. The on-state voltage as a TSEP (temperature sensitive electrical parameters) has advantages in terms of applicability and sensitivity to other approaches but it is influenced by the terminal connection voltage. This paper will develop a real-time model for the mean temperature of wire bondings. |
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| Filename: | 0483-epe2016-full-11073369.pdf |
| Filesize: | 2.605 MB |
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| Type |
Members Only |
| Date |
Last modified 2017-04-13 by System |
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