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Study of the Packaging Effect on Blocking Voltage of Power Devices During Durability Test
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| Author(s) |
NAOKI SAKURAI |
| Abstract |
We investigated why the blocking voltages of a power device are lowered during a durability test through a device simulation called Technology Computer Aided Design (TCAD) and measurements using the optical beam induced current (OBIC) method. We found that the spread of the depletion layer caused by the bonding wire is what decreased the blocking voltage. |
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| Filename: | 0281-epe2016-full-02271772.pdf |
| Filesize: | 586.1 KB |
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| Type |
Members Only |
| Date |
Last modified 2017-04-13 by System |
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