| Abstract |
This paper presents the work on an alternative integration scheme for a half-bridge switch using 70 µm thin Si IGBTs and diodes addressing higher strength, higher toughness and higher thermal conductivity. The switch is totally bond wireless, since bonded wires increase self-heating and introduce further thermomechanical degradation mechanisms. Moreover, this solution is equipped with double side liquid cooling, and plug-in edge connectors both on the driver and load sides, allowing high power density, good accessibility and modularity.The use of ad-hoc components, materials and techniques, as well as a good design using the latest CAD software for electrical simulation (SPICE) and the physical simulation of 3D thermal, thermo-fluid dynamic, electro-magnetic, and thermo-mechanical problems were considered at the early development stages. Here, particular attention is paid to physical simulations of the HBS and its edge connectors, to determine thermal and electro-magnetic behaviour. For example, in order to obtain an efficient heat extraction by the HBS, the design of a liquid-cooled heatsink was carried out by means of a CFD (Computational Fluid-Dynamic) analysis using COMSOL Multiphysics 5.2.Preliminary experimental results show good switching behavior. |
