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Investigation of the Characteristic Thermal Properties of IGBT Power Modules for Robust In-situ Health Monitoring
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| Author(s) |
Marco DENK |
| Abstract |
This paper investigates the characteristic thermal properties of IGBT power modules and develops a very robust health monitoring concept to identify an aged chip-solder within a voltage source inverter. It is shown that at an optimum excitation frequency the power module structure enables a selective identification of an increased thermal chip-solder resistance Rth,1 with a maximum Rth,1 measuring sensitivity. These outstanding features of the thermal power module structure were investigated in the frequency domain and verified by experimental measurements with artificially aged power modules. |
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| Filename: | 0049-epe2016-full-09292168.pdf |
| Filesize: | 1.984 MB |
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| Type |
Members Only |
| Date |
Last modified 2017-04-13 by System |
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