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High Performance 1700V IGBT Module with the 7th Generation Chipset/Package Technologies
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| Author(s) |
Mutsumi SAWADA |
| Abstract |
This paper describes 1700V IGBT module with the 7th generation (7G) IGBT technologies. Byfurther improvement of the chip characteristics and the development of new high reliability packagematerials and technologies, the performance of the modules are significantly improved.In addition, an extra thermal performance of lower thermal impedance is achieved with successfulimplementation of novel enhanced strength AlN isolation substrate. The integration of new chip andpackage technologies make it possible to achieve significant increase of watts density of about 30\%(11.2kW/cm2 (6G) -> 14.4kW/cm2 (7G)) |
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| Filename: | 0029-epe2016-full-10493154.pdf |
| Filesize: | 590.4 KB |
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| Type |
Members Only |
| Date |
Last modified 2017-04-13 by System |
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