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   Connector-less SiC power modules with integrated shunts - low-profile design for low inductance and low cost -   [View] 
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 Author(s)   Michael MEISSER 
 Abstract   This paper presents the design, manufacture and characterization of connector-less 1200 V SiC MOSFET half-bridge power modules based on AlN DCB substrate. The modules contain four MOSFETs and no external antiparallel diodes. They are rated for a current of 40 A and include a shunt. Static and dynamic measurement results are presented. Multiphysics simulations are used to validate the measured data. The modules show a power path inductance below 3 nH. The power rating of the implemented chip shunt resistors is sufficient for the performed characterizations but requires revision. The switching loss at turn-on is 340 µJ at 23 A, 800 V, the turn-off loss is well below 50 µJ, principally allowing MHz operation in resonant mode. 
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Filename:0039-epe2016-full-23093409.pdf
Filesize:1.714 MB
 Type   Members Only 
 Date   Last modified 2017-04-13 by System