| Abstract |
Packages of power semiconductors have considerable influence regarding the thermal impedance, the parasitic inductance, which affects the switching losses, and the reliability. In this paper, the performance of a phase leg of a PFC rectifier with PCB embedded power semiconductors is investigated. The mechanical stress in the PCB is analyzed by a FEM simulation and PCB design guidelines are given. The thermal impedance, parasitic inductance and switching losses of a real test setup are measured and compared with commercial modules. Based on this data, an optimization of a PFC rectifier with respect to volume, including the EMI filter, is performed for a converter using PCB embedded power semiconductors and compared to a converter using power semiconductors with conventional packaging. The converter using PCB embedded power semiconductors achieves a 21\% lower volume compared to a converter using power semiconductors with conventional packaging. |
