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The compact and high power density 7th generation IGBT module
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| Author(s) |
Alexander THEISEN |
| Abstract |
Recently the main requirements found in the market are further downsizing and higher efficiency ofpower conversion systems. Enhanced power density of the power modules will be the key to succeed.The increasing package reliability in higher junction temperature operation will be the majorchallenge. By further improvement of the chip characteristics and the development of new highreliability package materials and technologies, the performance of the modules were significantlyimproved. Additionally, the maximum operating temperature was even increased to up to 175°C. Thenew 7th generation IGBT module realized further downsizing and higher efficiency of powerconversion systems. |
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| Filename: | 0108-epe2015-full-11120842.pdf |
| Filesize: | 3.302 MB |
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| Type |
Members Only |
| Date |
Last modified 2016-06-08 by System |
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