| Filename: | 0469-epe2015-full-16083468.pdf |
| Filesize: | 945.7 KB |
| Failure to Short-Circuit Capability of Emerging Direct-Lead-Bonding Power Module. Comparison with Standard Interconnection. Application for Dedicated Fail-Safe | ||||||
| Author(s) | William SANFINS | |||||
| Abstract | The Direct-Lead-Bonding (DLB) interconnection appears to be a promising technology for power-module (PM). Nevertheless, the absence of wire-fuse-effect in case of extreme failure, compared to classical wire-bonding, leads authors to rethink fail-safe and fault-tolerant strategies for critical converter. Therefore, this paper will provide a comparative study between these two designs in terms of failure-mode and post-fault high-current capability. | |||||
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| Type | Members Only | |||||
| Date | Last modified 2016-06-08 by System | |||||
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