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ON-STATE ELECTROTHERMAL MODELLING OF LARGE AREA POWER COMPONENTS AND MULTICHIP POWER MODULES
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| Author(s) |
K. Bellil; P. Tounsi; J.-M. Dorkel; Ph. Leturcq |
| Abstract |
The paper presents a tool which associates simple electrical modelling in on-state conditions with a solver of the 3D heat diffusion equation in the chips and package in order to predict on-state current limits of all kind of power devices as well as the impact of damaged die bondings in multichip modules. |
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| Filename: | Unnamed file |
| Filesize: | 503.3 KB |
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| Type |
Members Only |
| Date |
Last modified 2016-04-04 by System |
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