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RELIABILITY OF HIGH POWER IGBT MODULES TESTING ON THERMAL FATIGUE EFFECTS DUE TO TRACTION CYCLES
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| Author(s) |
A. Hamidi; G. Coquery; R. Lallemand |
| Abstract |
This paper is a fourth contribution of INRETS Coquery et al (6) (9) (13) on the topic of thermal fatigue of high power IGBT modules in traction working conditions. The results of accelerated power cycling tests on 36 1200V-400A IGBT modules and on one 600V-1200A module are discussed. A technological
study is carried out to evaluate the effects of mechanical stresses due to
power cycles. The two main failure modes observed after such cycles are, on the one hand, the increase of collector emitter drop voltage (Vce) as a result of wire bond lift-off or chip metallisation degradation, and on the other hand, the increase of thermal resistance due to delamination in the solder between different layers. |
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| Filename: | Unnamed file |
| Filesize: | 783.4 KB |
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| Type |
Members Only |
| Date |
Last modified 2016-03-24 by System |
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