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MEASUREMENT OF CHIP CURRENTS IN IGBT MODULES
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| Author(s) |
P.R. Palmer; J.C. Joyce; B.H. Stark |
| Abstract |
IGBT modules employ a number of chips connected in parallel. Measurement of the effects on chip currents of layout topology and variations in chip parameters and temperatures requires a non-invasive current measurement system. Such a system, based on magnetic field measurements, has been used here to show that the steady-state current shming between chips is not ideal, and is exacerbated by uneven temperatures. Transient cunent redistribution also occurs at turn off. Thermal imaging was canied out to confirm the effects of this current redistribution in IGBT modules. It is shown that a significant temperature difference may be expected. The combination of the effects occurring is discussed, and it is concluded that further work is necessary regarding the matching of chips for reliable operation under certain load conditions. |
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| Filesize: | 588.3 KB |
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| Type |
Members Only |
| Date |
Last modified 2016-02-05 by System |
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