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THERMAL MONITORING OF INTEGRATED POWER ELECTRONICS: NEW CONCEPT
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| Author(s) |
W. Wojciak; M. Janicki; M. Zubert; A. Napieralski |
| Abstract |
This paper presents methods for monitoring of IC temperature. Firstly, an idea of gradient direction sensor
(GDS) which in the simplest case consists of three sensors properly placed and transforming signals from measured domain to the electrical ones is presented. Obtained voltage values give (after computing) the information about gradient direction of measured quantity, and its absolute value. In the first approach we focus on the implementation of GDS to the temperature measurement of single heat source placed on the surface of semiconductor device. We propose an arrangement of a few GDS in order to detect the presence of single heat source on the surface of! C. In the
next method density of power dissipated in heat sources and the structure temperature are estimated solving an inverse problem. For the calculations, the data read from temperature sensors and information about heat sources position are given. An example verifying the method is included. |
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| Filesize: | 303.2 KB |
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| Type |
Members Only |
| Date |
Last modified 2016-01-05 by System |
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