| Abstract |
Power semiconductor components,
including their further development as
monolithic power ICs, and hybrid system
integration are the driving forces behind advances in power electronic systems, particularly with regard to energy savings, improved control response, noise reduction, size weight reduction and cost minimization. Whereas in the lower voltage range Uoo < 1 OOV, monolithic system integration-driven by the exacting requirements of automobile electronics -
has made good progress, the first
milestones have also been set for conventional power electronic systems in
the range Uoo 2 600V. When discussing system integration, a distinction must be drawn between monolithic and hybrid integration. Most recent innovations have shown that the lowest power range for drive technology (I::;; 1A; U::;; 600V) can be implemented using monolithic integration of power semiconductor components + high-voltage IC engineering (drive/protection functions) + j..Jelectronics (system ICs). The power
range I ::;; 30A, U ::;; 1200V has been
implemented in hybrid system integration
at chip level (similar range of functions as with monolithic integration).
Inverters using this new technology
will be available in the ::;; 150A
range by the year 2000. Higher power
requirements can be implemented with
standard modules using conventional
system designs. Fig. 1 illustrates the
forecast development of MOS-driven
1 .01 0 power semiconductor components and power semiconductor modules and the power range of system integration. In 1996 IGBTs with an off-state voltage up to 3.5kV and high-performance modules in the current range up to approx. 2000A were launched on the market. For the current range up to approx. 30A and with a voltage range of up to 1200V, the first milestones in system integration using hybrid packaging technology have been set. Hybrid integration covers, in contrast to the IPM (Intelligent Power Module) or
ASIPM (Application Specific Intelligent
Power Module), the entire range of
power electronic system functions required for electrical drives.
The lowest power range (up to 1A,
600V) is covered using monolithic
system integration. The I ::;; 1 OOA,
U ::;; 1200V power range is covered
with 6/7 pack modules and the range
above 100 ::;; I ::;; 2000A, U ::;; 3.5kV by
standard modules using conventional
DCB packaging technology. In the 20A ::;; I ::;; 200A power range, .customer-specific modules with different
functions have been offered. As Fig. 1
clearly shows, the power range of
monolithic /hybrid system integration
will increase considerably by the year
2000 and thus covers the interesting
power range of the general purpose
drive and consumer drive markets. In
addition the power range of standard
modules will increase both in the U 2 6kV voltage range and the I > 2000 A current range. |
