| |
Thermal Management Details and their Influence on the Aging of Power Semiconductors
| [View]
[Download]
|
| Author(s) |
Martin SCHULZ |
| Abstract |
The major factor defining the wear and tear in power electronic components is temperature swing. The paper presents an insight to failure mechanisms and the benefits that can be gained if a holistic approach considering devices, adequate design-in and advanced thermal management is considered. |
| Download |
| Filename: | 0326-epe2014-full-13363721.pdf |
| Filesize: | 914 KB |
|
| Type |
Members Only |
| Date |
Last modified 2015-06-08 by System |
| |
 |