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System Design for Junction Temperatures up to 200°C
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| Author(s) |
Tobias KRONE, Thies KÖNEKE, Axel MERTENS |
| Abstract |
Manufacturers of power semiconductors and modules intend to rate the maximum junctiontemperature up to 200°C. This results in higher temperatures at other components of the invertersystem as well. In this paper, it is presented a method to identify thermal constraints in an inverterdesign by combining analytical and numerical analysis of the thermal spreading. Furthermore, anoverview of the thermal limits of the inverters components is given. The resulting thermal constraintsof an air-cooled system are discussed, and it is introduced an inverter design to avoid overtemperatures.Finally, the test results achieved from the constructed inverter at 200°C junctiontemperature are presented. |
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| Filename: | 0227-epe2014-full-21352291.pdf |
| Filesize: | 1.055 MB |
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| Type |
Members Only |
| Date |
Last modified 2015-06-08 by System |
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