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   P-Doped Region Below The AlGaN/GaN Interface For Normally-Off HEMT   [View] 
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 Author(s)   Saleem HAMADY, Frédéric MORANCHO, Bilal BEYDOUN, Patrick AUSTIN, Mathieu GAVELLE 
 Abstract   Development of a new design for enhancement-mode AlGaN/GaN HEMT is presented. The normally-off operation was achieved by burying a p-GaN region below the AlGaN/GaN interface only below the gate. Simulation results show that the proposed technique is capable of shifting the threshold voltage to positive values, making the HEMT normally-off. To address the advantages and drawbacks of the proposed structure a comparison with the normally-off Gate Injection Transistor (GIT) was performed. The proposed structure seems to be more effective when it comes to the p-doping concentration required to achieve normally-off operation and offers superior confinement for the two dimensional electron gas. On the other hand, the low forward gate voltage limits the increase of the threshold voltage. 
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Filename:0122-epe2014-full-00014070.pdf
Filesize:669.3 KB
 Type   Members Only 
 Date   Last modified 2015-06-08 by System