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Real-time degradation monitoring and lifetime estimation of 3D integrated bond-wire-less double-sided cooled power switch technologies
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| Author(s) |
Tianxiang DAI, Jian Feng LI, Martin CORFIELD, Alberto CASTELLAZZI, Pat WHEELER |
| Abstract |
This paper presents the development of an integrated power switch using Copper-Molybdenum-Copper interconnects for improved reliability and introduces a methodology for real-time degradation monitoring and reliability assessment of novel sandwich-type integrated power switches during passive thermal cycling. The proposed approach enables to realistically monitor degradation from time zero, allowing the flexible definition of the most suitable failure criteria and test time. |
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| Filename: | 0760-epe2013-full-17124273.pdf |
| Filesize: | 961.9 KB |
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| Type |
Members Only |
| Date |
Last modified 2014-02-09 by System |
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