| |
Partial Thermal Impedance Measurement for Die Interconnection Characterization by a microsecond "Pulsed Heating Curve Technique"
| [View]
[Download]
|
| Author(s) |
Benoit THOLLIN, Laurent DUPONT, Zoubir KHATIR, Yvan AVENAS, Jean-Christophe CREBIER, Pierre-Olivier JEANNIN |
| Abstract |
Due to new applicative domains like embedded systems, power electronic converters are getting moreand more compact, increasing their power densities and working in extreme environments with higherlifetime requirements in accordance with design to cost optimization. Power components packaging isthus involved in many research considerations such as thermal management, electromagneticinterference reduction and reliability. The thermal characterization of the die assembly is becoming achallenge in a power module due to the inaccessibility of the semiconductor parts in the module.This paper describes an innovative experimental method used to evaluate power chip interconnectionsolutions with the help of a transient thermal response of a power component. The experimental setupis designed to derive the thermal impedance of a power device in the microsecond scale in order toevaluate the thermal behaviour of the physical layers close to the chip. The method is then carried outwith power diodes in order to compare the thermal impedance of two power modules having differentsolder voids repartitions. The results show that this method has a very good sensibility that can be usedto compare the quality of the thermal behaviour of different die attaches. |
| Download |
| Filename: | 0587-epe2013-full-23191919.pdf |
| Filesize: | 2.088 MB |
|
| Type |
Members Only |
| Date |
Last modified 2014-02-09 by System |
| |
 |