| |
Multi-switch Si-chip structures and on-substrate packaging techniques for improving the electrical performance of power modules
| [View]
[Download]
|
| Author(s) |
Abdelilah EL KHADIRY, Frederic RICHARDEAU, Abdelhakim BOURENNANE, Dou ZHIFENG, Marie BREIL |
| Abstract |
Starting from the common anode and common cathode multi-switch Si-chips, this paper focuses on the different association techniques of the two power chips on the usual substrates (DBC/IMS). The study uses 3D multiphysics COMSOL simulations to determine the best association that would allow the best electrical performance of power converters. |
| Download |
| Filename: | 0605-epe2013-full-18530863.pdf |
| Filesize: | 1.539 MB |
|
| Type |
Members Only |
| Date |
Last modified 2014-02-09 by System |
| |
 |