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Features of wafer - Mo joining by sintering of silver paste for large area silicon devices
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| Author(s) |
Alexey SURMA, Anatoly CHERNIKOV, Alexander STAVTSEV |
| Abstract |
Conjunction of silicon crystals with surface over 10 cm² with molybdenum discs by means of silver paste sintering is being discussed. It is shown that to ensure strength of joint and low thermomechanical stress selection of dependencies of pressure and temperature on time is very important. It is necessary to ensure thermal stability of multilayer metal process on jointed surfaces. Experimental elements are characterized by reduced thermal resistance and high cycle stability. |
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| Filename: | 0137-epe2013-full-13095388.pdf |
| Filesize: | 417.5 KB |
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| Type |
Members Only |
| Date |
Last modified 2014-02-09 by System |
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