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Feasibility Study for Thermal Conductivity Simulation by Coupling between Admittance Matrix Method and Finite Elemental Method
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| Author(s) |
Kiyomi YOSHINARI, Kanazawa TAKURO, Akira MISHIMA |
| Abstract |
We developed a new method of coupling the finite elemental method (FEM) with the admittance matrix method to simulate the thermal conductivity of large-scale power electronics systems. The feasibility of this method was confirmed from the simulation results that showed the temperature changes differing by 6.5\% from those obtained by using the conventional FEM. The accuracy was improved more so that it can be used even if the Y region is divided into several Y blocks. The FEM-Y matrix coupling method also proved to be effective for ensuring there was less calculation time compared to that for the conventional FEM. The FEM-Y matrix coupling method was confirmed to reduce the calculation time by 48\% or more when compared to the conventional FEM, based on the number of times the thermal conductivity analysis is iterated. |
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| Filename: | 0057-epe2013-full-13372589.pdf |
| Filesize: | 363.1 KB |
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| Type |
Members Only |
| Date |
Last modified 2014-02-09 by System |
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