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Effects of Wire-bond Lift-off on Gate Circuit of IGBT Power Modules
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Author(s)
Shengqi Zhou, Luowei Zhou
Abstract
Effects of Wire-bond Lift-off on Gate Circuit of IGBT Power Modules
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Filename:
432.pdf
Filesize:
2.891 MB
Type
Members Only
Date
Last modified 2013-04-24 by System