| Abstract |
In this paper, the present practice in dealing with power packaging is revisited and its shortcomings
are indicated. A breakdown of power packaging based on physical parts of a power converter is
presented. Based on this breakdown, a new approach to the design of power converters and mapping
of function optimization onto the packaging level in circuit realization is introduced. This approach
deals with functional elements instead of conventional components, allowing for a higher integration
level as well as the integrated electrical, thermal and electromagnetic design. The integration domain
is expanded, now including electromagnetic integration and packaging elements integration,
particularly integration of thermal packaging elements. |
