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	A novel Intelligent Power Module (IPM) in a compact transfer mold package with new High Voltage Integrated Circuit (HVIC) and integrated bootstrap diodes	[View]   [Download]
Author(s)	Mustafa Cem ?zkilic, Thomas Radke, Marco Honsberg
Abstract	A novel Intelligent Power Module (IPM) in a compact transfer mold package with new High Voltage Integrated Circuit (HVIC) and integrated bootstrap diodes
Download	Filename: 159.pdf Filesize: 1.981 MB
Type	Members Only
Date	Last modified 2013-04-24 by System