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Reduced models for the temperature control of multichip power devices
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| Author(s) |
C. Rouaud; P. Lagonotte; A. Alexandre |
| Abstract |
Increasing power dissipations and reducing chip’s size generate great thermal stresses within
electronic module. Thus, the need for having accurate and fast simulating thermal models is
increasing. This paper presents a new methodology for obtaining reduced thermal models of power
devices. The application of such reduced models can be electro-thermal models, thermo-mechanical
simulations, real-time control of the junction temperature of IGBTs and FWDs. |
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| Filename: | EPE2003-PP0390 - Rouaud |
| Filesize: | 195.7 KB |
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| Type |
Members Only |
| Date |
Last modified 2003-10-14 by Unknown |
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