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On-line Junction Temperature Measurement of IGBTs based on Temperature Sensitive Electrical Parameters
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Author(s) |
Harald KUHN, Axel MERTENS |
Abstract |
This paper deals with a method to derive the junction temperature of an IGBT while the device is in operation. In order to achieve this the gate-emitter voltage, the collector current and the collector-emitter
voltage are digitized on the driver board. Due to the fact that material parameters vary with temperature, the waveforms of the switching transients vary with temperature, too. Thus, there is a correlation between
the temperature and the switching waveforms. Evaluating temperature sensitive electrical parameters (TSEP), the working temperature of the device can be estimated. |
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Filename: | 0401-epe2009-full-20241957.pdf |
Filesize: | 368.5 KB |
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Type |
Members Only |
Date |
Last modified 2010-01-27 by System |
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