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Increasing component reliability by Eliminating solder interfaces
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| Author(s) |
Uwe SCHEUERMANN |
| Abstract |
After the considerable progress in power semiconductor devices with respect to current density and maximum operation temperature, the packaging technology is shifted more and more into the focus of attention. Starting from the classical base plate module design, the presentation will discuss the limitations of lifetime under cyclical thermal stress. Advanced module architectures to overcome these limitations will be presented and improved interconnection techniques will be introduced. |
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| Filename: | 1109-epe2009-full-10525134.pdf |
| Filesize: | 2.796 MB |
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| Type |
Members Only |
| Date |
Last modified 2010-01-27 by System |
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